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PIC12LF1501 Datasheet(PDF) 155 Page - Microchip Technology

No. de pieza PIC12LF1501
Descripción Electrónicos  14-Pin Flash, 8-Bit Microcontrollers
PDF  352 Pages
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Fabricante Electrónico  MICROCHIP [Microchip Technology]
Página de inicio  http://www.microchip.com
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PIC12LF1501 Datasheet(HTML) 155 Page - Microchip Technology

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 2011-2015 Microchip Technology Inc.
DS40001607D-page 155
PIC16(L)F1503
The I2C interface supports the following modes and
features:
•Master mode
• Slave mode
• Byte NACKing (Slave mode)
• Limited Multi-master support
• 7-bit and 10-bit addressing
• Start and Stop interrupts
• Interrupt masking
• Clock stretching
• Bus collision detection
• General call address matching
•Address masking
• Address Hold and Data Hold modes
• Selectable SDAx hold times
Figure 21-2 is a block diagram of the I2C interface mod-
ule in Master mode. Figure 21-3 is a diagram of the I2C
interface module in Slave mode.
FIGURE 21-2:
MSSPX BLOCK DIAGRAM (I2C™ MASTER MODE)
Note 1:
In devices with more than one MSSP
module, it is very important to pay close
attention to SSPxCONx register names.
SSPxCON1 and SSPxCON2 registers
control different operational aspects of
the same module, while SSPxCON1 and
SSP2CON1 control the same features for
two different modules.
2:
Throughout this section, generic refer-
ences to an MSSPx module in any of its
operating modes may be interpreted as
being equally applicable to MSSPx or
MSSP2. Register names, module I/O sig-
nals, and bit names may use the generic
designator ‘x’ to indicate the use of a
numeral to distinguish a particular mod-
ule when required.
Read
Write
SSPxBUF
8
8
SSPxSR
8
Internal data
bus
Start bit, Stop bit,
Acknowledge
Generate
(SSPxCON2)
Baud Rate
Generator
(SSPxADD)
Shift clock
Start bit detected
Stop bit detected
Write collsion detect
Clock arbitration
State counter for end
of XMIT/RCV
Address match detect
SCLx in
Bus collision
MSb
LSb
SDAx
SCLx
SDAx in
Set/Reset: S, P, SSPxSTAT,
WCOL, SSPOV
Reset SEN, PEN (SSPxCON2)
Set SSPxIF, BCLxIF
4
[SSPM <3:0>]
Rev. 10-000077A
7/30/2013



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