STPS2150RL datasheet(4/7 Pages) STMICROELECTRONICS

4 / 7 page

Characteristics

STPS2150

4/7

Figure 9.

Reverse leakage current versus

reverse voltage applied (typical

values)

Figure 10.

Junction capacitance versus

reverse voltage applied (typical

values)

I (µA)

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

1.E+04

100

125

150

T =125°C

T =150°C

T =100°C

T =50°C

T =25°C

T =75°C

V (V)

C(pF)

100

1000

100

1000

V (V)

F=1MHz

=30mV

T =25°C

OSC

RMS

Figure 11.

Forward voltage drop versus

forward current - maximum values,

high level

Figure 12.

Forward voltage drop versus

forward current - maximum values,

low level

(A)

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

0.0

0.2

0.4

0.6

0.8

1.0

1.2

T =125°C

(typical values)

T =125°C

(maximum values)

T =25°C

(maximum values)

(V)

(A)

100

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

(V)

T =25°C

(maximum values)

T =125°C

(maximum values)

T =125°C

(typical values)

Figure 13.

Thermal resistance junction to

ambient versus copper surface

under each lead - Epoxy printed

circuit board FR4, eCu = 35 µm

(SMA)

Figure 14.

Thermal resistance versus lead

length (DO-15)

100

120

140

012

345

(°C/W)

th(j-a)

S (cm²)

R (°C/W)

100

120

10152025

Rth(j-a)

Rth(j-I)

(mm)

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