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ELANSC310 Datasheet(PDF) 72 Page - Advanced Micro Devices

No. de pieza ELANSC310
Descripción Electrónicos  Single-Chip, 32-Bit, PC/AT Microcontroller
PDF  119 Pages
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Fabricante Electrónico  AMD [Advanced Micro Devices]
Página de inicio  http://www.amd.com
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ELANSC310 Datasheet(HTML) 72 Page - Advanced Micro Devices

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72
Élan™SC310 Microcontroller Data Sheet
PREL IMINARY
THERMAL CHARACTERISTICS
The ÉlanSC310 microcontroller is specified for operation with a case temperature range from 0°C to 85°C for a com-
mercial device. Table 40 shows the thermal resistance for 208-pin QFP and TQFP packages.
Table 40.
Thermal Resistance (°C/Watt)
ψ
JT and θJA for 208-pin QFP and TQFP packages
TYPICAL POWER NUMBERS
Table 41 shows the typical power numbers that were
measured for the ÉlanSC310 microcontroller. These
measurements reflect the part when it is configured for
Maximum ISA mode operation at operating speeds of
33 MHz, 25 MHz, and 9.2 MHz. The connection of the
various power sections of the part are outlined in the
table so that the designer may have some relative in-
formation for the power consumption differences be-
tween 3.3-V operation and 5-V operation. Please see
the notes associated with the tables for specifics on the
test conditions.
Notes:
1. In normal operating mode measurements, the ÉlanSC310 microcontroller is running the LandMark Speedcom benchmark
(Version 2.00). All CPU idle cycles are run at the high-speed rate.
2. In Doze mode, the Doze mode configuration is such that the low-speed CPU clock is programmed to turn on for 64 refresh
cycles upon an IRQ0 (DOS timer) generation. After 64 refresh cycles, the low-speed CPU clock is turned off again. The IRQ0
timer is set for an approximate 55 ms interval and the refresh duty cycle is approximately 15.6
µs. In Doze mode, the high-
speed PLL is always turned off and, in this case, the low-speed PLL and video PLLs are on to allow the IRQ0 periodic wake-
up.
3. Suspend mode measurements were taken with DRAM refresh rate set at 8192 Hz (126
µs).
4. Micropower measurements were taken with DRAM unpowered and the DRAM refresh rate set at 8192 Hz.
5. These measurements were taken with the memory interface powered at 5 V, rather than 3.3 V.
All measurements were obtained at typical room temperature (ambient).
Package
ψ
JT
θ
JA vs. Airflow-Linear ft/min. (m/s)
0 (0)
200 (1.01)
400 (2.03)
600 (3.04)
800 (4.06)
QFP
4.7
33
26
25
23
22
TQFP
7
37.4
31.0
28.5
26.9
26.6
Table 41.
Typical Maximum ISA Mode Power Consumption
Power Pin
Maximum ISA Mode
Group
Name
Volts
33 MHz
25 MHz
9.2 MHz
Doze2
Suspend3
µ Pwr Off4
CPU Core
VCC
3.3
119 mA
94.3mA
39.1mA
6.12 mA
5.7
µA4.1 µA
I/O VCC
VCC1
5
5.55 mA
5.55mA
5.55mA
5.55 mA
0
µA
OFF
Analog
AVCC
3.3
2.58 mA
2.36 mA
2.24 mA
1.39 mA
19.9
µA19.8 µA
I/O
VCC5
5
772
µA
680
µA
434
µA
293
µA0 µA
OFF
Memory
VCCMEM
3.3
16.4 mA
12.6 mA
4.9 mA
190
µA
10.5
µA
OFF
Sub ISA Bus
VCCSYS
5
16.8 mA
13.7 mA
7.76 mA
3.6 mA
0
µA
OFF
Full ISA Bus
VCCSYS2
5
2.06 mA
1.57 mA
0.9 mA
21
µA0 µA
OFF
Total (mW)
582 mW
468mW
226mW
72.7 mW
0.12 mW
0.08 mW
Memory5
VCCMEM
5
26.5 mA
20.3 mA
8.75 mA
304
µA
17
µA
OFF
Total (mW)
660 mW
528 mW
470 mW
73.6 mW
0.17 mW
0.08 mW



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