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TDA8002AT/3/C2 Datasheet(PDF) 18 Page - NXP Semiconductors

No. de pieza TDA8002AT/3/C2
Descripción Electrónicos  IC card interface
PDF  28 Pages
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Fabricante Electrónico  PHILIPS [NXP Semiconductors]
Página de inicio  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

TDA8002AT/3/C2 Datasheet(HTML) 18 Page - NXP Semiconductors

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1997 Nov 04
18
Philips Semiconductors
Product specification
IC card interface
TDA8002
Notes
1. It may be necessary to put capacitors from XTAL1 and XTAL2 to ground depending on the choice of crystal or
resonator.
2. When the oscillator is stopped in mode 1, XTAL1 is set to HIGH.
3. The transition time and duty cycle definitions are shown in Fig.13;
4. PRES and CMDVCC are active LOW; RSTIN and PRES are active HIGH.
5. CLKOUT transition time and duty cycle do not need to be tested.
Strobe input (STROBE)
fSTROBE
frequency on STROBE
0
20
MHz
VIL
LOW-level input voltage
0
0.3VDD
V
VIH
HIGH-level input voltage
0.7VDD
VDD
V
Logic inputs (CLKSEL, CLKDIV1, CLKDIV2, MODE, CMDVCC and RSTIN); note 4
VIL
LOW-level input voltage
0
0.8
V
VIH
HIGH-level input voltage
1.8
VDD
V
Logic inputs (PRES, PRES); note 4
VIL
LOW-level input voltage
0
0.3VDD
V
VIH
HIGH-level input voltage
0.7VDD
VDD
V
IIL(PRES)
LOW-level input current on
pin PRES
VOL =0V
−−−10
µA
IIH(PRES)
HIGH-level input current on
pin PRES
−−
10
µA
Protections
Tsd
shut-down local temperature
135
−°C
ICC(sd)
shut-down current at VCC
−−
90
mA
Timing
tact
activation sequence duration
see Fig.9; guaranteed by
design
180
220
µs
tde
deactivation sequence duration
see Fig.11; guaranteed by
design
50
70
90
µs
t3
start of the window for sending
CLK to the card
see Figs 8 and 9
−−
130
µs
t5
end of the window for sending
CLK to the card
see Fig.8
150
−−µs
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
δ
t
1
t
1
t
2
+
---------------
=



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