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MPC8555CPXAPF Datasheet(PDF) 75 Page - Freescale Semiconductor, Inc |
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MPC8555CPXAPF Datasheet(HTML) 75 Page - Freescale Semiconductor, Inc |
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75 / 88 page ![]() MPC8555E PowerQUICC™ III Integrated Communications Processor Hardware Specifications, Rev. 4 Freescale Semiconductor 75 Thermal The spring mounting should be designed to apply the force only directly above the die. By localizing the force, rocking of the heat sink is minimized. One suggested mounting method attaches a plastic fence to the board to provide the structure on which the heat sink spring clips. The plastic fence also provides the opportunity to minimize the holes in the printed-circuit board and to locate them at the corners of the package. Figure 47 and provide exploded views of the plastic fence, heat sink, and spring clip. Figure 47. Exploded Views (1) of a Heat Sink Attachment using a Plastic Fence |
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