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33887 Datasheet(PDF) 7 Page - Freescale Semiconductor, Inc |
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33887 Datasheet(HTML) 7 Page - Freescale Semiconductor, Inc |
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7 / 37 page ![]() Analog Integrated Circuit Device Data Freescale Semiconductor 7 33887 ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS MAXIMUM RATINGS All voltages are with respect to ground unless otherwise noted. Rating Symbol Value Unit ELECTRICAL RATINGS Supply Voltage (1) V+ -0.3 to 40 V Input Voltage (2) VIN -0.3 to 7.0 V FS Status Output (3) V FS -0.3 to 7.0 V Continuous Current (4) IOUT 5.0 A DH Suffix HSOP ESD Voltage (5) Human Body Model Each Pin to AGND Each Pin to PGND Each Pin to V+ Each I/O to All Other I/Os Machine Model VESD1 VESD1 VESD1 VESD1 VESD2 ±1000 ±1500 ±2000 ±2000 ±200 V VW Suffix HSOP, SOICW-EP, and PQFN ESD Voltage (5) Human Body Model Machine Model VESD1 VESD2 ±2000 ±200 V THERMAL RATINGS Storage Temperature TSTG -65 to 150 °C Operating Temperature (6) Ambient Junction TA TJ -40 to 125 -40 to 150 °C Peak Package Reflow Temperature During Reflow (7), (8) TPPRT Note 8. °C Notes 1 Performance at voltages greater than 28V is degraded.See Electrical Performance Curves on page 18 and 19 for typical performance. Extended operation at higher voltages has not been fully characterized and may reduce the operational lifetime. 2 Exceeding the input voltage on IN1, IN2, EN, D1, or D2 may cause a malfunction or permanent damage to the device. 3 Exceeding the pull-up resistor voltage on the open Drain FS pin may cause permanent damage to the device. 4 Continuous current capability so long as junction temperature is ≤ 150 °C. 5 ESD1 testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 Ω), ESD2 testing is performed in accordance with the Machine Model (CZAP = 200 pF, RZAP = 0 Ω). 6 The limiting factor is junction temperature, taking into account the power dissipation, thermal resistance, and heat sinking provided. Brief nonrepetitive excursions of junction temperature above 150 °C can be tolerated as long as duration does not exceed 30 seconds maximum. (nonrepetitive events are defined as not occurring more than once in 24 hours.) 7 Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent damage to the device. 8. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics. |
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