ZXM64N03X

SEMICO NDUC TORS

ISSUE 1 - OCTOBER 2005

2

THERMAL RESISTANCE

PARAMETER

SYMBOL

VALUE

UNIT

Junction to Ambient (a)

113

°C/W

Junction to Ambient (b)

70

°C/W

NOTES:

(a) For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions

(b) For a device surface mounted on FR4 PCB measured at t 10 secs.

(c) Repetitive rating - pulse width limited by maximum junction temperature. Refer to Transient Thermal Impedance graph.

ABSOLUTE MAXIMUM RATINGS

PARAMETER

SYMBOL

LIMIT

UNIT

Drain-Source Voltage

30

V

Gate- Source Voltage

20

V

Continuous Drain Current

5.0

4.0

A

Pulsed Drain Current (c)

30

A

Continuous Source Current (Body Diode)(b)

2.4

A

Pulsed Source Current (Body Diode)(c)

30

A

Linear Derating Factor

1.1

8.8

W

Linear Derating Factor

1.8

14.4

W

Operating and Storage Temperature Range

-55 to +150

°C