PX3511ADAG-R3 datasheet(4/10 Pages) INTERSIL

4 / 10 page

FN6462.0

February 26, 2007

Absolute Maximum Ratings

Thermal Information

Supply Voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15V

Supply Voltage (PVCC) . . . . . . . . . . . . . . . . . . . . . . . . . VCC + 0.3V

BOOT Voltage (VBOOT). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36V

Input Voltage (VPWM) . . . . . . . . . . . . . . . . . . . . . . GND - 0.3V to 7V

UGATE. . . . . . . . . . . . . . . . . . . VPHASE - 0.3VDC to VBOOT + 0.3V

VPHASE - 3.5V (<100ns Pulse Width, 2µJ) to VBOOT + 0.3V

LGATE . . . . . . . . . . . . . . . . . . . . . . GND - 0.3VDC to VPVCC + 0.3V

GND - 5V (<100ns Pulse Width, 2µJ) to VPVCC + 0.3V

PHASE. . . . . . . . . . . . . . . GND - 0.3VDC to 15VDC (VPVCC = 12V)

GND - 8V (<400ns, 20µJ) to 30V (<200ns, VBOOT-GND<36V)

ESD Rating

Human Body Model . . . . . . . . . . . . . . . . . . . . Class I JEDEC STD

Recommended Operating Conditions

Ambient Temperature Range . . . . . . . . . . . . . . . . . . . . 0°C to +85°C

Maximum Operating Junction Temperature . . . . . . . . . . . . . +125°C

Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12V

±10%

Supply Voltage Range, PVCC . . . . . . . . . . . . . . . . 5V to 12V

±10%

Thermal Resistance

θJA (°C/W) θJC (°C/W)

SOIC Package (Note 1) . . . . . . . . . . . .

100

N/A

DFN Package (Notes 2, 3) . . . . . . . . . .

Maximum Junction Temperature (Plastic Package) . . . . . . . +150°C

Maximum Storage Temperature Range . . . . . . . . . . -65°C to +150°C

Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . +300°C

(SOIC - Lead Tips Only)

CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the

device at these or any other conditions above those indicated in the operational sections of this specification is not implied.

NOTES:

JA is measured with the component mounted on a high effective thermal conductivity test board in free air.

JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See

Tech Brief TB379.

3. For

θJC, the “case temp” location is the center of the exposed metal pad on the package underside.

Electrical Specifications

Recommended Operating Conditions, Unless Otherwise Noted.

PARAMETER

SYMBOL

TEST CONDITIONS

MIN

TYP

MAX

UNITS

VCC SUPPLY CURRENT

Bias Supply Current

IVCC

PX3511A, fPWM = 300kHz, VVCC = 12V

PX3511B, fPWM = 300kHz, VVCC = 12V

4.5

IVCC

PX3511A, fPWM = 1MHz, VVCC = 12V

10.5

PX3511B, fPWM = 1MHz, VVCC = 12V

Gate Drive Bias Current

IPVCC

PX3511A, fPWM = 300kHz, VPVCC = 12V

PX3511B, fPWM = 300kHz, VPVCC = 12V

7.5

IPVCC

(Note 4)

PX3511A, fPWM = 1MHz, VPVCC = 12V

PX3511B, fPWM = 1MHz, VPVCC = 12V

8.5

POWER-ON RESET AND ENABLE

VCC Rising Threshold

9.35

9.8

10.0

VCC Falling Threshold

7.35

7.6

8.0

PWM INPUT (See Timing Diagram on Page 6)

Input Current

IPWM

VPWM = 3.3V

505

µA

VPWM = 0V

-460

µA

PWM Rising Threshold (Note 4)

VCC = 12V

1.70

PWM Falling Threshold (Note 4)

VCC = 12V

1.30

Typical Three-State Shutdown Window

VCC = 12V

1.23

1.82

Three-State Lower Gate Falling Threshold

VCC = 12V

1.18

Three-State Lower Gate Rising Threshold

VCC = 12V

0.76

Three-State Upper Gate Rising Threshold

VCC = 12V

2.36

PX3511A, PX3511B

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