AND8044/D

http://onsemi.com

3

120

0

Figure 5. Single 1206A ChipFET

160

Single EVB

Min. Footprint

TIME (Secs)

40

80

1

10

100

1000

1” Square PCB

SUMMARY

The thermal results for the single–channel 1206A

ChipFET package display similar power dissipation

performance to the SO–8 with a footprint reduction of 80%.

Careful design of the package has allowed for this

performance to be achieved. The short leads allow the die

size to be maximized and thermal resistance to be reduced

within the confines of the TSOP–6 body size.