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STM32U545NET6QTR Datasheet(PDF) 272 Page - STMicroelectronics |
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STM32U545NET6QTR Datasheet(HTML) 272 Page - STMicroelectronics |
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272 / 283 page ![]() Package information STM32U545xx 272/283 DS14216 Rev 1 6.6 WLCS72 package information This WLCSP is a 72-ball, 3.38 x 3.38 mm, 0.35 mm pitch, wafer level chip scale package. Figure 70. WLCSP72 - Outline 1. Drawing is not to scale. 2. Dimension is measured at the maximum bump diameter parallel to primary datum Z. 3. Primary datum Z and seating plane are defined by the spherical crowns of the bump. 4. Bump position designation per JESD 95-1, SPP-010. The tolerance of position that controls the location of the pattern of balls with respect to datums X and Y. For each ball there is a cylindrical tolerance zone ccc perpendicular to datum Z and located on true position with respect to datums X and Y as defined by e. The axis perpendicular to datum Z of each ball must lie within this tolerance zone. G F e1 A2 BALL LOCATION e BOTTOM VIEW e A C B D E e2 F G H J 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 A1 bbb Z DETAIL A A A2 SIDE VIEW A3 A2 ORIENTATION REFERENCE X aaa (4X) Y D E FRONT VIEW TOP VIEW DETAIL A ROTATED 90 (not in scale) SEATING PLANE ccc ddd Z Z XY eee Z Z BUMP B0HK_WLCSP72_ME_V1 b (72x) |
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