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LSF0102DDFR Datasheet(PDF) 49 Page - Texas Instruments |
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LSF0102DDFR Datasheet(HTML) 49 Page - Texas Instruments |
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49 / 57 page ![]() www.ti.com EXAMPLE BOARD LAYOUT 0.05 MIN ALL AROUND TYP 4X (0.25) 4X (0.4) (0.25) TYP (R0.05) TYP (0.6) (0.8) (0.4) (0.2) TYP (0.027) TYP (0.2) TYP EXPOSED METAL CLEARANCE X2SON - 0.4 mm max height DTQ0006A PLASTIC SMALL OUTLINE - NO LEAD 4224056/A 11/2017 NOTES: (continued) 6. This package is designed to be soldered to a thermal pads on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 7. Vias are optional depending on application, refer to device data sheet. If some or all are implemented, recommended via locations are shown. SYMM 1 2 3 SYMM 4 5 LAND PATTERN EXAMPLE SOLDER MASK DEFINED SCALE:50X 6 METAL UNDER SOLDER MASK TYP TYP SOLDER MASK OPEING |
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