Table 4. Thermal resistance

Symbol

Parameters

Value

Unit

Rth(j-l)

Junction to lead (DC)

Typ.

60

°C/W

Rth(j-a)

Junction to ambient (DC) for 5 cm2 copper surface

Typ.

400

1.1

Characteristics (curves)

Figure 1. Maximum average power dissipation versus

average on-state current

0.0

0.2

0.4

0.6

0.8

1.0

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

α = 30 °

α = 60 °

α = 90 °

α = 120 °

α = 180 °

DC

P(W)

IT(AV)(A)

α

360 °

Figure 2. Average and DC on-state current versus lead

temperature

0.0

0.2

0.4

0.6

0.8

1.0

0

25

50

75

100

125

α = 30 °

α = 60 °

α = 90 °

α = 120 °

α = 180 °

DC

T

L(°C)

IT(AV)(A)

Figure 3. On-state characteristics (maximum values)

0.1

1.0

10.0

0.0

3.0

4.0

5.0

1.0

2.0

T

j

= 125 °C

ITM(A)

VTM(V)

T

j

= 25 °C

Tj max: 125 °C

Vt0 = 1.06 V

Rd = 540 mΩ

Figure 4. Average and D.C. on-state current versus

ambient temperature

0.0

0.2

0.3

0

25

50

75

100

125

0.1

IT(AV)(A)

DC

α = 180 °

Ta(°C)

X0115ML

Characteristics (curves)

DS13776 - Rev 3

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