7 Detailed Description

7.1 Overview

The ESD341 device is a bidirectional ESD Protection Diode with ultra-low capacitance. This device can dissipate

ESD strikes above the maximum level specified by the IEC 61000-4-2 International Standard. The ultra-low

capacitance allows this device to protect high-speed signal pins including HDMI 1.4b.

7.2 Functional Block Diagram

IO

GND

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7.3 Feature Description

7.3.1 IEC 61000-4-2 ESD Protection

The I/O pins can withstand ESD events up to ±30 kV contact and ±30 kV air gap. An ESD-surge clamp diverts

the current to ground.

7.3.2 IEC 61000-4-5 Surge Protection

The I/O pins can withstand surge events up to 5.4 A and 54 W (8/20 µs waveform). An ESD-surge clamp diverts

this current to ground.

7.3.3 IO Capacitance

The capacitance between each I/O pin to ground is 0.66 pF (typical). This device supports data rates up to 3.4

Gbps.

7.3.4 DC Breakdown Voltage

The DC breakdown voltage of each I/O pin is ±6.2 V (typical). This DC breakdown voltage ensures that sensitive

equipment is protected from surges above the reverse standoff voltage of ±3.6 V.

7.3.5 Ultra Low Leakage Current

The I/O pins feature an ultra-low leakage current of 100 nA (maximum) with a bias of ±3.6 V.

7.3.6 Low ESD Clamping Voltage

7.3.7 Supports High Speed Interfaces

This device is capable of supporting high speed interfaces up to 3.4 Gbps, because of the extremely low IO

capacitance.

7.3.8 Industrial Temperature Range

This device features an industrial operating range of –40°C to +125°C.

7.4 Device Functional Modes

During ESD events, voltages as high as ±30 kV (air or contact) can be directed to ground through the internal

nano-seconds) the device reverts to passive.

ESD341

SLVSGV3A – APRIL 2022 – REVISED JULY 2022

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