6 Specifications

Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)

MIN

MAX

UNIT

Peak Pulse (2) (3)

54

W

5.4

A

Ambient Operating Temperature

-40

125

°C

Junction Temperature

-40

125

°C

Storage Temperature

-65

155

°C

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute maximum ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If briefly operating outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not

sustain damage, but it may not be fully functional. Operating the device in this manner may affect device reliability, functionality,

performance, and shorten the device lifetime.

(2)

Voltages are with respect to GND unless otherwise noted.

(3)

Measured at 25

℃

6.1 ESD Ratings—JEDEC Specification

VALUE

UNIT

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/

JEDEC JS-001

±2500

V

Charged device model (CDM), per JEDEC

specification JS-002

±1000

V

6.2 ESD Ratings—IEC Specification

VALUE

UNIT

Electrostatic discharge

IEC 61000-4-2 contact discharge

±30000

V

IEC 61000-4-2 air-gap discharge

±30000

Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Input pin voltage

Pin 1 to 2 or Pin 2 to 1

-3.6

3.6

V

Operating free-air temperature

-40

125

°C

6.3 Thermal Information

THERMAL METRIC (1)

ESD341

UNIT

DPL (X2SON)

2 PINS

Junction-to-ambient thermal resistance

356.8

°C/W

Junction-to-case (top) thermal resistance

208.8

°C/W

Junction-to-board thermal resistance

136.2

°C/W

Junction-to-top characterization parameter

3.0

°C/W

Junction-to-board characterization parameter

135.7

°C/W

Junction-to-case (bottom) thermal resistance

NA

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

ESD341

SLVSGV3A – APRIL 2022 – REVISED JULY 2022

www.ti.com

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