SWCS049G datasheet(13/144 Pages) TI

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TPS65911

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SWCS049S – JUNE 2010 – REVISED AUGUST 2018

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Specifications

(1)

VCC7 should be connected to highest supply that is connected to device VCCx pin.

Exception: VCC4, VCC5, and V5IN inputs can be higher than VCC7. VCCS can be higher than VCC7 if VMBBUF_BYPASS = 0 (buffer

is enabled).

5.3

Recommended Operating Conditions

Over operating free-air temperature range (unless otherwise noted)

(1)

MIN

NOM

MAX

UNIT

Input voltage range

VCC1, VCC2, VCCIO, VCC5, VCC7, VCCS, VCC4,

VBACKUP

2.7

3.8

5.5

VCC3

1.7

3.8

5.5

VDDIO

1.65

1.8/3.3

3.45

VCC6

1.4

3.3

3.6

V5IN

4.5

6.5

VBST

–0.1

3.45

SW (<30% of repetitive period)

–1

TRIP, VFB

–0.1

6.5

PWRON

3.8

5.5

SDA_SDI, SCL_SCK, EN2, EN1, SLEEP, INT1,

CLK32KOUT

1.65

VDDIO

3.45

PWRHOLD, HDRST

1.65

VRTC

5.5

Input voltage range

GPIO0, GPIO1, GPIO2, GPIO3, GPIO4, GPIO5, GPIO6,

GPIO7, GPIO8, PWRDN

1.65

VRTC

5.5

VCCS

5.5

Ambient temperature

–40

°C

Junction temperature, TJ

–40

125

(1)

For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics application report.

(2)

These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RθJC] value, which is based on a

JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these

EIA/JEDEC standards:

•

JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)

•

JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

•

JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

•

JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements

Power dissipation of 2 W and an ambient temperature of 70ºC is assumed.

5.4

Thermal Information

THERMAL METRIC(1) (2)

TPS65911x

UNIT

ZRC (BGA)

98 PINS

RθJA

Junction-to-ambient thermal resistance

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

°C/W

RθJB

Junction-to-board thermal resistance

°C/W

ψJT

Junction-to-top characterization parameter

0.2

°C/W

ψJB

Junction-to-board characterization parameter

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

SWCS049G Datasheet(PDF) 13 Page - Texas Instruments

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