SWCS049G datasheet(12/144 Pages) TI

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TPS65911

SWCS049S – JUNE 2010 – REVISED AUGUST 2018

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Specifications

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

I/O supplied from VRTC, but can be driven from VCC7 or to VCC7 voltage level.

(3)

Input supplied from VRTC, but can be driven from VCC7 voltage level.

Specifications

5.1

Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Voltage range on

pins

VCC1, VCC2, VCCIO, VCC3, VCC4, VCC5, VCC7, VBACKUP,

V5IN, TRIP

–0.3

VCC6

–0.3

3.6

VDDIO

–0.3

3.6

VBST

–0.3

–5

SW1, SW2, SWIO

–0.3

VFB1, VFB2, VFBIO

–0.3

3.6

VOUT, VFB

–0.3

OSC32KIN, OSC32KOUT, BOOT1

–0.3

VRTCMAX + 0.3

SDA_SDI, SCL_SCK, EN2, EN1, SLEEP, INT1, CLK32KOUT,

NRESPWRON

–0.3

VDDIOMAX + 0.3

PWRON

–0.3

PWRHOLD, GPIO0

–0.3

Voltage range on

pins

GPIO1, GPIO2, GPIO3, GPIO4, GPIO5, GPIO6, GPIO7, GPIO8(2)

–0.3

HDRST

–0.3

NRESPWRON2(2)

–0.3

PWRDN(3)

–0.3

VCCS

–0.3

Peak output current on all other pins than power resources

–5

5.0

Functional junction temperature

–45

150

°C

Storage temperature, Tstg

–65

150

°C

(1)

JEDEC document JEP155 statues that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP155 statues that 250-V HBM allows safe manufacturing with a standard ESD control process.

5.2

ESD Ratings

VALUE

UNIT

VESD

Electrostatic

discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS001(1)

±2000

Charged device model (CDM), per JESD22-C101(2)

±500

SWCS049G Datasheet(PDF) 12 Page - Texas Instruments

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