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MIC45116 Datasheet(PDF) 7 Page - Microchip Technology |
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MIC45116 Datasheet(HTML) 7 Page - Microchip Technology |
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7 / 42 page ![]() 2016 - 2022 Microchip Technology Inc. DS20005571B-page 7 MIC45116 TEMPERATURE SPECIFICATIONS Parameters Sym. Min. Typ. Max. Units Conditions Temperature Ranges Operating Junction Temperature Range TJ –40 — +125 °C Note 1 Absolute Maximum Junction Temperature TJ(ABSMAX) — — +150 °C — Storage Temperature Range TS –65 — +150 °C — Lead Temperature TLEAD — — +260 °C Soldering, 10 seconds Package Thermal Resistances 52-lead 8 mm x 8 mm x 3 mm H3QFN JA — 22 — °C/W Note 2 52-lead 8 mm x 8 mm x 3 mm H3QFN JC — 5 — °C/W Note 2 Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability. 2: JA and JC were measured using the MIC45116 evaluation board. |
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