MIC45116 datasheet(29/42 Pages) MICROCHIP

No. de pieza	MIC45116

Descripción Electrónicos	20V/6A DC/DC Power Module

PDF	42 Pages

Scroll/Zoom	100%

Fabricante Electrónico	MICROCHIP [Microchip Technology]

Página de inicio	http://www.microchip.com

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2016 - 2022 Microchip Technology Inc.

DS20005571B-page 29

MIC45116

7.2

Solder Paste Stencil Design

(Recommended Stencil Thickness

= 112.5 ±12.5 µm)

The solder stencil aperture openings should be smaller

than the periphery or large PCB exposed pads to

reduce any chance of build-up of excess solder at the

large exposed pad area which can result to solder

bridging.

The suggested reduction of the stencil aperture

opening is typically 0.20 mm smaller than exposed

metal trace.

Please note that a critical requirement is to not

duplicate land pattern of the exposed metal trace as

solder stencil opening because the design and

dimension values are different.

Cyan-colored shaded pad areas indicate exposed

trace keep-out area in Figure 7-2 and Figure 7-3.

FIGURE 7-2:

Solder Stencil Opening.

FIGURE 7-3:

Stack-Up of Pad Layout and

Solder Paste Stencil.

MIC45116 Datasheet(PDF) 29 Page - Microchip Technology