MPC8560CPX667JC datasheet(82/108 Pages) NXP

No. de pieza	MPC8560CPX667JC

Descripción Electrónicos	Integrated Processor Hardware Specifications

PDF	108 Pages

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Fabricante Electrónico	NXP [NXP Semiconductors]

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MPC8560 Integrated Processor Hardware Specifications, Rev. 4.2

Freescale Semiconductor

Thermal

15.4 Frequency Options

Table 59 shows the expected frequency values for the platform frequency when using a CCB to SYSCLK

ratio in comparison to the memory bus speed.

16 Thermal

This section describes the thermal specifications of the MPC8560.

16.1 Thermal Characteristics

Table 60 provides the package thermal characteristics for the MPC8560.

Table 59. Frequency Options with Respect to Memory Bus Speeds

CCB to

SYSCLK

Ratio

SYSCLK (MHz)

16.67

33.33

41.63

66.67

100

111

133.33

Platform/CCB Frequency (MHz)

200

222

267

200

250

300

333

267

333

208

333

200

250

200

267

333

225

300

250

333

200

300

267

Table 60. Package Thermal Characteristics

Characteristic

Symbol

Value

Unit

Notes

Junction-to-ambient Natural Convection on four layer board (2s2p)

RθJMA

°C/W

1, 2

Junction-to-ambient (@100 ft/min or 0.5 m/s) on four layer board (2s2p)

RθJMA

°C/W

1, 2

Junction-to-ambient (@200 ft/min or 1 m/s) on four layer board (2s2p)

RθJMA

°C/W

1, 2

Junction-to-board thermal

RθJB

7.5

°C/W

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