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MPC8560CPX667JC Datasheet(PDF) 26 Page - NXP Semiconductors |
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MPC8560CPX667JC Datasheet(HTML) 26 Page - NXP Semiconductors |
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26 / 108 page ![]() MPC8560 Integrated Processor Hardware Specifications, Rev. 4.2 26 Freescale Semiconductor Ethernet: Three-Speed, MII Management Figure 8 provides the AC test load for TSEC. Figure 8. TSEC AC Test Load Figure 9 shows the GMII receive AC timing diagram. Figure 9. GMII Receive AC Timing Diagram RX_CLK clock rise and fall time tGRXR, tGRXF 2,3 —— 1.0 ns Note: 1.The symbols used for timing specifications herein follow the pattern of t(first two letters of functional block)(signal)(state) (reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tGRDVKH symbolizes GMII receive timing (GR) with respect to the time data input signals (D) reaching the valid state (V) relative to the tRX clock reference (K) going to the high state (H) or setup time. Also, tGRDXKL symbolizes GMII receive timing (GR) with respect to the time data input signals (D) went invalid (X) relative to the tGRX clock reference (K) going to the low (L) state or hold time. Note that, in general, the clock reference symbol representation is based on three letters representing the clock of a particular functional. For example, the subscript of tGRX represents the GMII (G) receive (RX) clock. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall). 2.Signal timings are measured at 0.7 V and 1.9 V voltage levels. 3.Guaranteed by design. Table 22. GMII Receive AC Timing Specifications (continued) At recommended operating conditions with LVDD of 3.3 V ± 5%, or LVDD=2.5V ± 5%. Parameter/Condition Symbol 1 Min Typ Max Unit Output LVDD/2 RL = 50 Ω Z0 = 50 Ω RX_CLK RXD[7:0] tGRDXKH tGRX tGRXH tGRXR tGRXF tGRDVKH RX_DV RX_ER |
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