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PBLS6002D Datasheet(PDF) 3 Page - NXP Semiconductors

No. de pieza PBLS6002D
Descripción Electrónicos  60 V PNP BISS loadswitch
PDF  16 Pages
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Fabricante Electrónico  PHILIPS [NXP Semiconductors]
Página de inicio  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

PBLS6002D Datasheet(HTML) 3 Page - NXP Semiconductors

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© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 — 23 June 2005
3 of 16
Philips Semiconductors
PBLS6002D
60 V PNP BISS loadswitch
5.
Limiting values
[1]
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2]
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2.
[3]
Device mounted on a ceramic PCB, Al2O3, standard footprint.
Table 5:
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
TR1; PNP low VCEsat transistor
VCBO
collector-base voltage
open emitter
-
−80
V
VCEO
collector-emitter voltage
open base
-
−60
V
VEBO
emitter-base voltage
open collector
-
−5V
IC
collector current (DC)
[1] -
−700
mA
[2] -
−850
mA
[3] -
−1A
ICM
peak collector current
single pulse;
tp ≤ 1ms
-
−2A
IB
base current (DC)
-
−300
mA
IBM
peak base current
single pulse;
tp ≤ 1ms
-
−1A
Ptot
total power dissipation
Tamb ≤ 25 °C
[1] -
250
mW
[2] -
350
mW
[3] -
400
mW
TR2; NPN resistor-equipped transistor
VCBO
collector-base voltage
open emitter
-
50
V
VCEO
collector-emitter voltage
open base
-
50
V
VEBO
emitter-base voltage
open collector
-
10
V
VI
input voltage
positive
-
+30
V
negative
-
−10
V
IO
output current (DC)
-
100
mA
ICM
peak collector current
-
100
mA
Ptot
total power dissipation
Tamb ≤ 25 °C
[1] -
200
mW
[2] -
200
mW
[3] -
200
mW
Per device
Ptot
total power dissipation
Tamb ≤ 25 °C
[1] -
400
mW
[2] -
530
mW
[3] -
600
mW
Tstg
storage temperature
−65
+150
°C
Tj
junction temperature
-
150
°C
Tamb
ambient temperature
−65
+150
°C



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