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HT1X Datasheet(PDF) 2 Page - NXP Semiconductors |
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HT1X Datasheet(HTML) 2 Page - NXP Semiconductors |
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2 / 9 page ![]() HT1X_SDS All information provided in this document is subject to legal disclaimers. © NXP B.V. 2014. All rights reserved. Product short data sheet COMPANY PUBLIC Rev. 3.1 — 10 December 2014 210531 2 of 9 NXP Semiconductors HT1x HITAG 1 transponder IC 4. Quick reference data 5. Ordering information [1] This package is also known as MOA4 Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit Wafer EEPROM characteristics tret retention time Tamb 55 C10 - - year Nendu(W) write endurance 100000 - - cycle Interface characteristics Ci input capacitance between LA and LB HT1ICS3002W/V6F 189 210 231 pF Table 2. Ordering information Type number Package Name Description Version HT1ICS3002W/V6F Wafer sawn wafer on FFC, 150 m, 8 inch, UV, inkless - HT1MOA4S30/E/3 PLLMC plastic leadless module carrier package; 35 mm wide tape SOT500-2[1] |
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