4

OPA607

SBOS981 – OCTOBER 2019

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Copyright © 2019, Texas Instruments Incorporated

(1)

Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not supported.

(2)

Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5 V beyond the supply rails should

be current limited to 10 mA or less.

(3)

Short-circuit to ground, one amplifier per package.

6 Specifications

6.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

6

V

V

±5

V

±10

mA

±20

mA

Continuous power dissipation

See Thermal Information

Maximum junction temperature

150

°C

Operating free-air temperature

–40

125

°C

Storage temperature

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic

discharge

±3000

V

±1000

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

2.2

5.5

V

±1.1

±2.75

Ambient operating temperature

–40

25

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

OPA607

UNIT

DCK (SC70)

6 PINS

Junction-to-ambient thermal resistance

219.7

°C/W

Junction-to-case (top) thermal resistance

182.6

°C/W

Junction-to-board thermal resistance

105.7

°C/W

Junction-to-top characterization parameter

87

°C/W

Junction-to-board characterization parameter

105.4

°C/W