eGaN® FET DATASHEET

EPC2016C

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DIE MARKINGS

Figure 12: Safe Operating Area

0.1

1

10

100

0.1

1

10

100

Pulse Width

100 ms

10 ms

1 ms

100 s

TAPE AND REEL CONFIGURATION

4 mm pitch, 8 mm wide tape on 7” reel

7” reel

a

d

e

f

g

c

b

EPC2016C (note 1)

Dimension (mm) target min max

a

8.00 7.90 8.30

b

1.75 1.65 1.85

c (see note)

3.50 3.45 3.55

d

4.00 3.90 4.10

e

4.00 3.90 4.10

f (see note)

2.00 1.95 2.05

g

1.5

1.5

1.6

Note 1: MSL 1 (moisture sensitivity level 1) classied according to IPC/JEDEC industry standard.

Note 2: Pocket position is relative to the sprocket hole measured as true position of the pocket,

not the pocket hole.

Die

orientation

dot

Gate

solder bar is

under this

corner

Die is placed into pocket

solder bar side down

(face side down)

Loaded Tape Feed Direction

2016

YYYY

ZZZZ

Part

Number

Laser Markings

Part #

Marking Line 1

Lot_Date Code

Marking line 2

Lot_Date Code

Marking Line 3

EPC2016C

2016

YYYY

ZZZZ

Die orientation dot

Gate Pad bump is

under this corner