UCD7201 datasheet(9/20 Pages) TI

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Thermal Information

Circuit Layout Recommendations

UCD7201

SLUS645B – FEBRUARY 2005 – REVISED JULY 2005

Note that the PowerPAD™ is not directly connected

to any leads of the package. However, it is electrically

The useful range of a driver is greatly affected by the

and thermally connected to the substrate which is the

drive power requirements of the load and the thermal

ground of the device. The PowerPad™ should be

characteristics of the device package. In order for a

connected to the quiet ground of the circuit.

power driver to be useful over a particular tempera-

ture range the package must allow for the efficient

removal of the heat produced while keeping the

junction temperature within rated limits. The UCD7K

In a power driver operating at high frequency, it is

family of drivers is available in PowerPAD™ TSSOP

critical to minimize stray inductance to minimize

and QFN/DFN packages to cover a range of appli-

overshoot/undershoots and ringing. The low output

cation requirements. Both have an exposed pad to

impedance of these drivers produces waveforms with

enhance thermal conductivity from the semiconductor

high di/dt. This tends to induce ringing in the parasitic

junction.

inductances. It is advantageous to connect the driver

device close to the MOSFETs. It is recommended

As illustrated in Reference [2], the PowerPAD™

that the PGND and the AGND pins be connected to

packages offer a leadframe die pad that is exposed at

the PowerPad™ of the package with a thin trace. It is

the base of the package. This pad is soldered to the

critical to ensure that the voltage potential between

copper on the PC board (PCB) directly underneath

these two pins does not exceed 0.3 V. The use of

the device package, reducing the TJC down to

schottky diodes on the outputs to PGND and PVDD is

2.07°C/W. The PC board must be designed with

recommended when driving gate transformers.

thermal lands and thermal vias to complete the heat

removal subsystem, as summarized in Reference [3].

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