APM3095P datasheet(7/9 Pages) ANPEC

7 / 9 page

 ANPEC Electronics Corp.

Rev. A.1 - Oct., 2002

www.anpec.com.tw

APM3095P

Physical Specifications

Terminal Material

Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb)

Lead Solderability

Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.

Reflow Condition (IR/Convection or VPR Reflow)

Reference JEDEC Standard J-STD-020A APRIL 1999

Classification Reflow Profiles

Convection or IR/ Convection

VPR

Average ramp-up rate(183

°C to Peak)

°C/second max.

°C /second max.

Preheat temperature 125

± 25°C)

120 seconds max.

Temperature maintained above 183

°C

60 ~ 150 seconds

Time within 5

°C of actual peak

temperature

10 ~ 20 seconds

60 seconds

Peak temperature range

220 +5/-0

°C or 235 +5/-0°C

215~ 219

°C or 235 +5/-0°C

Ramp-down rate

°C /second max.

Time 25

°C to peak temperature

6 minutes max.

Package Reflow Conditions

pkg. thickness

≥≥≥≥ 2.5mm

and all bags

pkg. thickness < 2.5mm and

pkg. volume

≥≥≥≥ 350 mm³

pkg. thickness < 2.5mm and pkg.

volume < 350mm³

Convection 220 +5/-0

°C

Convection 235 +5/-0

°C

VPR 215-219

°C

VPR 235 +5/-0

°C

IR/Convection 220 +5/-0

°C

IR/Convection 235 +5/-0

°C

Pre-heat temperature

183 C

Peak temperature

Time

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