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GD25LB128DSJS Datasheet(PDF) 66 Page - GigaDevice Semiconductor (Beijing) Inc.

No. de pieza GD25LB128DSJS
Descripción Electrónicos  1.8V Uniform Sector Dual and Quad Serial Flash
PDF  75 Pages
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Fabricante Electrónico  GIGADEVICE [GigaDevice Semiconductor (Beijing) Inc.]
Página de inicio  http://www.gigadevice.com/
Logo GIGADEVICE - GigaDevice Semiconductor (Beijing) Inc.

GD25LB128DSJS Datasheet(HTML) 66 Page - GigaDevice Semiconductor (Beijing) Inc.

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1.8V Uniform Sector
Dual and Quad Serial Flash
GD25LB128D
66
(T= -40℃~125℃, VCC=1.65~2.0V, CL=30pf)
Symbol
Parameter
Min.
Typ.
Max.
Unit.
fC
Serial Clock Frequency For: all command except for 03H
104
MHz
fR
Serial Clock Frequency For: Read (03H)
80
MHz
tCLH
Serial Clock High Time
4
ns
tCLL
Serial Clock Low Time
4
ns
tCLCH
Serial Clock Rise Time (Slew Rate)
0.2
V/ns
tCHCL
Serial Clock Fall Time (Slew Rate)
0.2
V/ns
tSLCH
CS# Active Setup Time
5
ns
tCHSH
CS# Active Hold Time
5
ns
tSHCH
CS# Not Active Setup Time
5
ns
tCHSL
CS# Not Active Hold Time
5
ns
tSHSL
CS# High Time (Read/Write)
20
ns
tSHQZ
Output Disable Time
6
ns
tCLQX
Output Hold Time
1.2
ns
tDVCH
Data In Setup Time
2
ns
tCHDX
Data In Hold Time
2
ns
tCLQV
Clock Low To Output Valid
7
ns
tDP
CS# High To Deep Power-Down Mode
20
μs
tRES1
CS# High To Standby Mode Without Electronic Signature
Read
20
μs
tRES2
CS# High To Standby Mode With Electronic Signature
Read
20
μs
tRST
CS# High To Next Command After Reset (Except From
Erase)
30
μs
tRST_E
CS# High To Next Command After Reset (From Erase)
12
ms
tSUS
CS# High To Next Command After Suspend
20
us
tRS
Latency Between Resume And Next Suspend
100
μs
tW
Write Status Register Cycle Time
5
30
ms
tPP
Page Programming Time
0.5
4
ms
tSE
Sector Erase Time
70
500
ms
tBE1
Block Erase Time (32K Bytes)
0.16
1.5
s
tBE2
Block Erase Time (64K Bytes)
0.3
3.0
s
tCE
Chip Erase Time (GD25LB128D)
50
150
s
Note:
1. Typical value tested at T = 25℃.
2. Value guaranteed by design and/or characterization, not 100% tested in production.



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