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AP65251 Datasheet(PDF) 3 Page - Diodes Incorporated |
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AP65251 Datasheet(HTML) 3 Page - Diodes Incorporated |
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3 / 19 page ![]() AP65251 Document number: DS36109 Rev. 1 - 2 3 of 19 www.diodes.com October 2017 © Diodes Incorporated AP65251 Absolute Maximum Ratings (Note 4) (@TA = +25°C, unless otherwise specified.) Symbol Parameter Rating Unit VIN Supply Voltage -0.3 to 20 V VSW Switch Node Voltage -1.0 to VIN +0.3 V VBST Bootstrap Voltage VSW -0.3 to VSW +6.0 V VFB Feedback Voltage -0.3V to +6.0 V VEN Enable/UVLO Voltage -0.3V to +16.0 V TST Storage Temperature -65 to +150 °C TJ Junction Temperature +160 °C TL Lead Temperature +260 °C ESD Susceptibility (Note 5) HBM Human Body Mode 2000 V CDM Charge Device Model 1000 V Notes: 4. Stresses greater than the 'Absolute Maximum Ratings' specified above may cause permanent damage to the device. These are stress ratings only; functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be affected by exposure to absolute maximum rating conditions for extended periods of time. 5. Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling and transporting these devices. Thermal Resistance (Note 6) Symbol Parameter Rating Unit θJA Junction to Ambient TSOT26 122 °C/W θJC Junction to Case TSOT26 28 °C/W Note: 6. Test condition for SOT26: Device mounted on FR-4 substrate, single-layer PC board, 2oz copper, with minimum recommended pad layout Recommended Operating Conditions (Note 7) (@TA = +25°C, unless otherwise specified.) Symbol Parameter Min Max Unit VIN Supply Voltage 4.5 16 V TA Operating Ambient Temperature Range -40 +85 °C Note: 7. The device function is not guaranteed outside of the recommended operating conditions. |
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