MODEL: ST-025BH

PRODUCT: Electromagnetic Buzzer

EDITION: A/2017

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RELIABILITY TEST

item

test conditions

evaluation standard

operating life test

ORDINARY TEMPERATURE

The part will be subjected to 96 hours of

continuous operation at +25 ±10ºC.

After the test the part will meet specifications

without any degradation in appearance and

performance except SPL, after 4 hours at +25ºC.

Allowable variation of SPL after test: ±10dB

HIGH TEMPERATURE

The part will be subjected to 72 hours of

continuous operation at +85ºC with 3.6V,

2700Hz applied.

LOW TEMPERATURE

The part will be subjected to 72 hours of

continuous operation at -30ºC with 3.6V, 2700Hz

applied.

TEST CONDITION

Standard Test Condition: a) Temperature : +5 ~ +35ºC

b) Humidity : 45 ~ 85%

c) Pressure : 860 ~ 1060mbar

MECHANICAL CHARACTERISTICS

item

test conditions

evaluation standard

solderability

Lead terminal are immersed in rosin for 5

seconds and then immersed in solder bath of

+260 ±5oC for 3 ±0.5 seconds

90% min. lead terminals will be wet with solder

No interference in operation.

soldering heat resistance

The product followed the reflow temperature

curve to test its reflow thermostability.

terminal mechanical

strength

Lead pads will be soldered on the pc board, and

the force 9.8N(1.0Kg) will be applied behind the

part for 10 seconds.

No damage and cutting off.

vibration

The part will be subjected to a vibration cycle of

10Hz to 55Hz to 10Hz in a period of 1 minute.

Total peak amplitude will be 1.52mm(9.3G). The

vibration test will consist of 2 hours per axis in

each three axes(X,Y,Z). Total 6 hours.

After the test the part will meet specifications

without any damage in appearance and

performance except SPL.

The SPL would be ±10dBA compared with the

initital one.

drop test

The part only will be dropped from a height of

75cm onto a 40mm thick wooden board 3 times

in 3 axes(X,Y,Z). A total of 9 times.

RECOMMENDED WAVE SOLDERING TEMPERATURE CURVE

Recommendable reflow soldering condition as follows:

Note 1: It is requested that reflow soldering should be executed after

heat of product goes down to notrmal tempertaure.

Note 2: Peak reflow temperature of 250ºC Max 10 sec. with a maximum

duration of 40-60 sec. between 220ºC and 250ºC