Datasheet

4

1.0

2017-12-07

TLE94003EP

Pin Configuration

1

Pin Configuration

1.1

Pin Assignment

Figure 1

Pin Configuration TLE94003EP with direct interface

1.2

Pin Definitions and Functions

Pin

Symbol

Function

1

IN1

Direct input control for power half-bridge 1

2

IN2

Direct input control for power half-bridge 2

3

IN3

Direct input control for power half-bridge 3

4

TEST

Test input. This pin can be left open or be terminated to ground

5

VS

Main supply voltage for power half bridges.

6OUT 3

Power half-bridge 3

7OUT 1

Power half-bridge 1

8GND

Ground

9OUT 2

Power half-bridge 2

10

N.U.

Not used. This pin should either be left open or terminated to ground.

11

EN1

Enable input for Half-bridges 1/2 with internal pull-down

12

EN2

Enable input for Half-bridge 3 with internal pull-down

13

EF

Error Flag

14

VDD

Logic supply voltage

EDP

-

Exposed Die Pad; For cooling and EMC purposes only - not usable as electrical

1) The exposed die pad at the bottom of the package allows better heat dissipation from the device via the PCB. The

exposed pad (EP) must be either left open or connected to GND. It is recommended to connect EP to GND for best

EMC and thermal performance.

IN 1

VDD

IN 2

IN 3

TEST

VS

OUT 3

OUT 1

EN2

EN1

EF

N.U.

OUT 2

GND

1

2

3

4

5

6

7

14

13

12

11

10

9

8