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SC14CVMDECT-SF Datasheet(PDF) 15 Page - Dialog Semiconductor |
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SC14CVMDECT-SF Datasheet(HTML) 15 Page - Dialog Semiconductor |
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15 / 57 page ![]() Datasheet Revision 3.0 28-Jul-2015 CFR0011-120-00-FM Rev 5 15 of 57 © 2013 Dialog Semiconductor SC14CVMDECT SF Cordless Voice Module FINAL 4.3 AUDIO CONFIGURATIONS The SC14CVMDECT SF audio supports standard DECT audio qualities. The audio gain and volume parameters are placed in the VES. The DECT gains can be adjusted to meet the TBR38 and TBR10 audio level requirements by using the SC14CVMDECT SF application reference design. For other line and acous- tic designs it is required to adjust and tune the audio setup. 4.3.1 Audio connection The SC14CVMDECT SF PP audio connections are shown in Figure 8. Refer to "Example application dia- gram" on page 49 for detailed component values. . Earpiece or small loudspeaker connection The earpiece loudspeaker can be connected either dif- ferentially or single-ended. Dynamic loudspeakers with an impedance of 30 can be connected, as well as ceramic loudspeakers equivalent to 600 and 30 F. Refer to Table 28 for a detailed specification or the ear- piece loudspeakers. The earpiece is connected to the LSRp and LSRn pins. Microphone connection The microphone can be connected either single-ended via MICp or differentially to MICp and MICn. Headset connection The headset microphone must be connected to the MICh pin. The headset earpiece is connected to the LSRp. Microphone supply connection For active microphones a voltage source with high sup- ply voltage rejection ratio is provided on supply pins VREFp/VREFm. Filtering of internal and external refer- ence voltages is provided by an internal capacitor. No external capacitor shall be connected to pin VREFp. To avoid audible switching noise it is important that the ground supply signals are directly “star point” con- nected to the VREFm and not via a common ground plane. From this VREFm star point, one connection is made to the common ground plane. Loudspeaker connection For the handsfree operation a 4 loudspeaker must be connected to the PAOUTp and PAOUTn pins as shown in Figure 9. The VDDPA is the supply pin. Refer to Table 31 for a detailed specification of the external components around the loudspeaker. These components are necessary to guarantee the lifetime of the module. Figure 8: Audio connections LSRn LSRp MICh MICn VREFm MICp VREFp Figure 9: Loudspeaker connection PAOUTp PAOUTn VDDPA VSS/GND C_VDDPA Cs_PAOUT Rs_PAOUT Cs_PAOUT Rs_PAOUT |
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