SC14CVMDECT-SF datasheet(56/57 Pages) DIALOG

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Datasheet

Revision 3.0

28-Jul-2015

CFR0011-120-00-FM Rev 5

56 of 57

SC14CVMDECT SF

Cordless Voice Module

FINAL

12.0 Revision history

09-Jul-2013

v1.0:

• Initial version.

12-Sep-2013

v1.1:

• Ordering code for tray version corrected.

• Ordering code for tape-on-reel version removed.

08-Nov-2013

v1.2:

• Added section 10.2 (Industry Canada require-

ments regarding the end product and the end

user).

31-Jan-2014

v1.3:

• Updated section 11.3 (Copper pad, solder open-

ing and stencil).

11-Feb-2014

v1.4:

• Corrected section 11.3 (Copper pad, solder open-

ing and stencil).

16-Apr-2014

v1.5:

• Added an explanation for RF1 in section 4.13.

29-Aug-2014

v1.6:

• Changed RF output power specification.

• Added SF02 description.

24-Dec-2014

v1.7:

• Updated section 4.13.2 (Internal and external

antenna with FAD).

28-Jul-2015

v3.0 (Final):

• Product status: Production.

• Features:

• Added support for NiMH and Alkaline batteries.

• Section 1.0:

• Ordering information table added (Table 1).

• Section 2.2:

• Reference to AN-D-204 removed.

• Reference [4] updated with file name.

• Reference [6] changed from AN-D-211 to

AN-D-212.

• Reference [7] corrected to AN-D-222.

• Section 3.2:

• Added default configuration: US DECT, FP and

CoLA enabled.

• Section 4.1 (Caution):

• Added max. UART input voltage (3.45 V).

• Section: 3.9:

• Number of PP registrations per FP rephrased

(Table 5).

• Section 6.0 (Register descriptions) added.

• Supply currents moved from section 7.8 to new

section 7.4.

• Updated supply currents for full-slot operation

(Table 19) and for long-slot operation (Table 20).

• Table 35 (Radio specifications):

• Added HPM to conditions for NTP.

• Added NTP specification for LPM.

• Table 36 (RFPA preferred settings):

• Removed ‘(PP application)’ from title, because

RFPA settings are valid for both FP and PP.

•Note 32: added Japan DECT specification for

long-slot operation.

• Table 38 (RF frequencies and channel numbers):

•Note 33 added for J-DECT channels 1, 2 and 3.

• Section 10.0: added link to reference [6].

• Section 11.0:

• Reflow soldering profile updated (Figure 39).

• Soldering stencil thickness changed to

0.130 mm.

• Package outline drawing updated (Figure 43).

• Back page:

• Status definition table updated.

• Contact information updated.

• Template updated to latest version.

SC14CVMDECT-SF Datasheet(PDF) 56 Page - Dialog Semiconductor

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