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0879392000 Datasheet (PDF) - Molex Electronics Ltd.

No. de pieza	0879392000

Descripción Electrónicos	2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row Dual Body, with Plastic Pegs, 20 Circuits, 2.50關m (100關) Tin (Sn) Plating, 15.35mm(.604) Stacking Height

Tamaño del archivo	333.43 Kbytes

Html View	1 2 3 4 5 6

Fabricante Electrónico	MOLEX10 [Molex Electronics Ltd.]

Página de inicio	http://www.molex.com

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0879392000 Datasheet (PDF) - Molex Electronics Ltd.

Número de pieza similar - 0879392000

Fabricante Electrónico	No. de pieza	Datasheet	Descripción Electrónicos
Molex Electronics Ltd.	0879390001	103Kb / 3P	2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row Dual Body, with Plastic Pegs, 16 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
Molex Electronics Ltd.	0879394001	334Kb / 6P	2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row Dual Body, with Plastic Pegs, 40 Circuits, 0.75關m (30關) Gold (Au) Selective Plating, 6.40mm(.251)

Descripción similar - 0879392000

Fabricante Electrónico	No. de pieza	Datasheet	Descripción Electrónicos
Molex Electronics Ltd.	0879370406	102Kb / 3P	2.54mm (.100) Pitch KK짰 Header, Single Row Dual Body, Through Hole, Vertical, 4 Circuits, 2.50關m (100關) Tin (Sn) Plating, 11.00mm (.433) Stacking Height
	0879200830	1Mb / 12P	2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 8 Circuits, 2.50關m (98關) Tin (Sn) Plating, with Pick-and-Place Cap
	0879370502	102Kb / 3P	2.54mm (.100) Pitch KK짰 Header, Single Row Dual Body, Through Hole, Vertical, 5 Circuits, 2.50關m (100關") Tin (Sn) Plating, 11.00mm (.433) Stacking Height
	0877970040	196Kb / 4P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row Dual Body, Vertical, 40 Circuits, 2.54關m (100關) Tin (Sn) Plating, 14.22mm (.560) Stacking Height
	0879370106	102Kb / 3P	2.54mm (.100) Pitch KK짰 Header, Single Row Dual Body, Through Hole, Vertical, 1 Circuits, 2.50關m (100關) Tin (Sn) Plating, 11.00mm (.433) Stacking Height
	0879370802	102Kb / 3P	2.54mm (.100) Pitch KK짰 Header, Single Row Dual Body, Through Hole, Vertical, 8 Circuits, 2.50關m (100關) Tin (Sn) Plating, 11.00mm (.433) Stacking Height
	0879394001	334Kb / 6P	2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row Dual Body, with Plastic Pegs, 40 Circuits, 0.75關m (30關) Gold (Au) Selective Plating, 6.40mm(.251)
	0879390001	103Kb / 3P	2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row Dual Body, with Plastic Pegs, 16 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
	0879370800	194Kb / 4P	2.54mm (.100) Pitch KK짰 Header, Single Row Dual Body, Through Hole, Vertical, 8 Circuits, 2.50關m (100關) Tin (Sn) Plating, 12.00mm (.472) Stacking Height
	0879371206	102Kb / 3P	2.54mm (.100) Pitch KK짰 Header, Single Row Dual Body, Through Hole, Vertical, 12 Circuits, 2.50關m (100關) Tin (Sn) Plating, 11.00mm (.433) Stacking Height

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