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Motor de Búsqueda de Datasheet de Componentes Electrónicos |
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Motor de Búsqueda de Datasheet de Componentes Electrónicos |
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LCYW5SM Datasheet(PDF) 13 Page - OSRAM GmbH |
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LCYW5SM Datasheet(HTML) 13 Page - OSRAM GmbH |
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13 / 22 page  Version 1.2 LCY W5SM 2017-06-22 13 Recommended Solder Pad 7) page 21 Reflow soldering Empfohlenes Lötpaddesign 7) Seite 21 Reflow-Löten Note: For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not suitable for ultra sonic cleaning. Anm.: Um eine verbesserte Lötstellenkontaktierung zu erreichen, empfehlen wir, unter Standard- Stickstoffatmosphäre zu löten. Das Gehäuse ist für Ultraschallreinigung nicht geeignet. Solder resist Freies Kupfer Bare Copper Lötpasten Schablone Solder paste stencil Lötstopplack OHAY0681 Kupfer Copper 1.6 (0.063) 11.6 (0.457) 12.0 (0.472) 1.6 (0.063) 11.6 (0.457) 3 Lötstellen 3 solder points Thermal enhanced PCB Thermisch optimiertes PCB ø4.0 (0.157) Heatsink attach ø4.0 (0.157) ø2.5 (0.098) |
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