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Motor de Búsqueda de Datasheet de Componentes Electrónicos |
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LHT6MF Datasheet(PDF) 12 Page - OSRAM GmbH |
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LHT6MF Datasheet(HTML) 12 Page - OSRAM GmbH |
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12 / 22 page  2015-06-18 12 Version 1.0 LH T6MF Recommended Solder Pad 9) page 21 Reflow soldering Empfohlenes Lötpaddesign 9) Seite 21 Reflow-Löten Recommended Solder Pad 9) page 21 Reflow soldering Empfohlenes Lötpaddesign 9) Seite 21 Reflow-Löten OHLPY970 2.6 (0.102) Cu-area > 16 mm Cu-Fläche > 16 mm 2 2 Solder resist Lötstopplack 2.6 (0.102) Padgeometrie für improved heat dissipation verbesserte Wärmeableitung Paddesign for OHLPY440 Padgeometrie für verbesserte Wärmeableitung improved heat dissipation Paddesign for Lötstoplack Solder resist 0.8 (0.031) 2.3 (0.091) 3.3 (0.130) Cu Fläche / 16 mm per pad 2 Cu-area _ < 3.3 (0.130) Kathode/ Cathode Anode 0.7 (0.028) Fläche darf bei Verwendung von TOPLED® For TOPLED® assembly do not use elektrisch nicht beschaltet werden. this area for electrical contact Fläche darf bei Verwendung von TOPLED® For TOPLED® assembly do not use elektrisch nicht beschaltet werden. this area for electrical contact |
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