Version 1.0

LG T67F

2012-03-12

13

Reflow Soldering Profile

Reflow Lötprofil

Preconditioning: JEDEC Level 2 acc. to J-STD-020D.01

0

0

s

OHA04525

50

100

150

200

250

300

50

100

150

200

250

300

t

T

˚C

S

t

t

P

t

T

p

240 ˚C

217 ˚C

245 ˚C

25 ˚C

L

OHA04612

Profil-Charakteristik

Profile Feature

25 ˚C

≤ T ≤ 150 ˚C

2

3

K/s

Time from T

150 ˚C

≤ T

t

S

t

L

t

P

T

L

T

P

100

120

60

10

20

30

80

100

217

23

245

260

36

Time

25 ˚C

≤ T ≤ T

P

Time within 5 ˚C of the specified peak

temperature T

Ramp-down Rate*

T

All temperatures refer to the center of the package, measured on the top of the component

* slope calculation

ΔT/Δt: Δt max. 5 s; fulfillment for the whole T-range

T

Liquidus Temperature

Peak Temperature

Time above Liquidus temperature

Symbol

Symbol

Einheit

Unit

Pb-Free (SnAgCu) Assembly

Minimum

Maximum

Recommendation

K/s

K/s

s

s

s

s

˚C

˚C

480