Molded Guide

www.vishay.com

Vishay Sprague

Revision: 12-Sep-17

2

Document Number: 40074

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

SOLID ELECTROLYTE TANTALUM CAPACITORS

Solid electrolyte capacitors contain manganese dioxide,

which is formed on the tantalum pentoxide dielectric layer

by impregnating the pellet with a solution of manganous

nitrate. The pellet is then heated in an oven, and the

manganous nitrate is converted to manganese dioxide.

The pellet is next coated with graphite, followed by a layer

of metallic silver, which provides a conductive surface

between the pellet and the Leadframe.

Molded Chip tantalum capacitor encases the element in

plastic resins, such as epoxy materials. After assembly, the

capacitors are tested and inspected to assure long life and

reliability. It offers excellent reliability and high stability for

consumer and commercial electronics with the added

feature of low cost

Surface mount designs of “Solid Tantalum” capacitors use

lead frames or lead frameless designs as shown in the

accompanying drawings.

TANTALUM CAPACITORS FOR ALL DESIGN

CONSIDERATIONS

Solid electrolyte designs are the least expensive for a given

rating and are used in many applications where their very

small size for a given unit of capacitance is of importance.

They will typically withstand up to about 10 % of the rated

DC working voltage in a reverse direction. Also important

are their good low temperature performance characteristics

and freedom from corrosive electrolytes.

Vishay Sprague patented the original solid electrolyte

capacitors and was the first to market them in 1956. Vishay

Sprague has the broadest line of tantalum capacitors and

has continued its position of leadership in this field. Data

sheets covering the various types and styles of Vishay

Sprague capacitors for consumer and entertainment

electronics, industry, and military applications are available

where detailed

performance

characteristics

must

be

specified.



MOLDED CHIP CAPACITOR, ALL TYPES EXCEPT 893D / TF3 / T86

MOLDED CHIP CAPACITOR WITH BUILT-IN FUSE, TYPES 893D / TF3 / T86

Leadframe

Epoxy

Encapsulation

Anode

Polarity Bar

Solderable

Cathode

Termination

Silver

Adhesive

Silver Coating

Solderable Anode

Termination

Sintered

Tantalum

Silver Adhesive

Solderable Cathode

Termination

Sintered Tantalum

Pellet

Lead Frame

Fusible

Wire

Solderable

Anode Termination

Anode Polarity Bar

Epoxy Encapsulation

MnO

Coating