AD9656EBZ datasheet(12/47 Pages) AD

12 / 47 page

Data Sheet

AD9656

Rev. A | Page 11 of 46

ABSOLUTE MAXIMUM RATINGS

Table 8.

Parameter

Rating

Electrical

AVDD to AGND

−0.3 V to +2.0 V

DRVDD to AGND

−0.3 V to +2.0 V

DVDD to DVSS

−0.3 V to +2.0 V

SVDD to AGND

−0.3 V to +3.9 V

Digital Outputs to AGND

−0.3 V to +2.0 V

CLK+, CLK− to AGND

−0.3 V to +2.0 V

VINx+, VINx− to AGND

−0.3 V to +2.0 V

SYSREF± to AGND

−0.3 V to +2.0 V

SYNCINB± to AGND

−0.3 V to +2.0 V

SCLK, SDIO, CSB, PDWN to AGND

−0.3 V to +3.9 V

SYNC to AGND

−0.3 V to +2.0 V

RBIAS to AGND

−0.3 V to +2.0 V

VCM, VREF, SENSE to AGND

−0.3 V to +2.0 V

Environmental

Operating Temperature Range (Ambient)

−40°C to +85°C

Maximum Junction Temperature

150°C

Lead Temperature (Soldering, 10 sec)

300°C

Storage Temperature Range (Ambient)

−65°C to +150°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

θJA is for a 4-layer printed circuit board (PCB) with solid ground

plane (simulated). The exposed pad is soldered to the PCB ground.

Table 9. Thermal Resistance

Package

Type

Air Flow

Velocity

(m/sec)

θJA

(°C/W)

θJB

(°C/W)1

θJC Top

(°C/W)1

θJC Bottom

(°C/W)1

56-Lead

LFCSP,

8 mm ×

8 mm

22.4

7.7

7.42

2.29

19.0

N/A

2.5

17.6

N/A

N/A means not applicable.

ESD CAUTION

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