µA741, µA741Y

GENERAL-PURPOSE OPERATIONAL AMPLIFIERS

SLOS094B – NOVEMBER 1970 – REVISED SEPTEMBER 2000

3

POST OFFICE BOX 655303

µA741Y chip information

This chip, when properly assembled, displays characteristics similar to the

µA741C. Thermal compression or

ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive

epoxy or a gold-silicon preform.

BONDING PAD ASSIGNMENTS

CHIP THICKNESS: 15 TYPICAL

BONDING PADS: 4

× 4 MINIMUM

TJmax = 150°C.

TOLERANCES ARE

±10%.

ALL DIMENSIONS ARE IN MILS.

+

–

OUT

IN +

IN –

VCC+

(7)

(3)

(2)

(6)

(4)

VCC –

(5)

(1)

OFFSET N2

OFFSET N1

45

36

(1)

(8)

(7)

(6)

(5)

(4)

(3)

(2)