 |
Motor de Búsqueda de Datasheet de Componentes Electrónicos |
|
|
Motor de Búsqueda de Datasheet de Componentes Electrónicos |
|
MPC7457 Datasheet(PDF) 41 Page - Freescale Semiconductor, Inc |
|
|
|||||||||||||||||||||||||||||
MPC7457 Datasheet(HTML) 41 Page - Freescale Semiconductor, Inc |
|
|
41 / 68 page  MPC7457 RISC Microprocessor Hardware Specifications, Rev. 5 Freescale Semiconductor 41 Package Description 8 Package Description The following sections provide the package parameters and mechanical dimensions for the CBGA package. 8.1 Package Parameters for the MPC7447, 360 CBGA The package parameters are as provided in the following list. The package type is 25 × 25 mm, 360-lead ceramic ball grid array (CBGA). Package outline 25 × 25 mm Interconnects 360 (19 × 19 ball array – 1) Pitch 1.27 mm (50 mil) Minimum module height 2.72 mm Maximum module height 3.24 mm Ball diameter 0.89 mm (35 mil) 8.2 Mechanical Dimensions for the MPC7447, 360 CBGA Figure 20 provides the mechanical dimensions and bottom surface nomenclature for the MPC7447, 360 CBGA package. |
|
Enlace URL |
| ¿ALLDATASHEET es útil para Ud.? [ DONATE ] |
Todo acerca de Alldatasheet | Publicidad | Contáctenos | Política de Privacidad | Enlace a la hoja de datos | Intercambio de Enlaces | Lista de Fabricantes All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |
Spanish ▼
English
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
Indian
Mexican
British
New Zealand
