The calculated failure rate for this device/process is:

The parameters used to calculate this failure rate are as follows:

Cf: 60%

Ea: 0.7

B: 0

Tu: 25

Vu: 5.5

°C

Volts

The reliability data follows. Some of the data in this report may be generic. A the start of this data is

a description of the assembly vehicle used to generate this reliability data. The next section is the

detailed reliability data for each stress. If there are additional assemblies used as part of this report,

a description of each will follow which includes the respective reliability data for that assembly.

Where appropriate, preconditioning is performed before all stresses and the bond crater test unless

otherwise noted. The reliability data section includes the latest data available.

Failure Rates are reported in FITs (Failures in Time) or MTTF (Mean Time To Failure). The FIT rate

is related to MTTF by:

MTTF = 1/Fr

NOTE: MTTF is frequently used interchangeably with MTBF.

FITS:

3.0

MTTF (YRS): 37651

FAILURE RATE:

Assembly Site:

ASE

Body Size:

8x13.4x0.965

Pin Count:

28

Package Type:

TSOP

Lead Frame:

Stamped Alloy 42

Assembly Information:

Lead Finsh:

Sn Plate 100% Matte

Mold Compound:

Sumitomo G700

Die Attach:

Sumitomo 1076 DS

Bond Wire / Size:

Au / 1.0 mil

Moisture Sensitivity

(JEDEC J-STD20A)

Level 3

Flammability:

UL 94-V0

0429

0429

to

Date Code Range:

Theta JA:

Theta JC:

PACKAGE TESTS

DESCRIPTION

READPOINT

CONDITION

QTY FAILS

DATE CODE

FA#

JESD22-B102

15

0

SOLDERABILITY

0429

0

Total: