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M93C56-R Datasheet(PDF) 28 Page - STMicroelectronics |
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M93C56-R Datasheet(HTML) 28 Page - STMicroelectronics |
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28 / 35 page ![]() Package information M93C86-x M93C76-x M93C66-x M93C56-x M93C46-x 28/35 DocID4997 Rev 17 11.3 UFDFN8 package information Figure 16. UFDFN8 - 8-lead, 2 × 3 mm, 0.5 mm pitch ultra thin profile fine pitch dual flat package outline 1. Max. package warpage is 0.05 mm. 2. Exposed copper is not systematic and can appear partially or totally according to the cross section. 3. Drawing is not to scale. 4. The central pad (the area E2 by D2 in the above illustration) must be either connected to Vss or left floating (not connected) in the end application. |
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