Package mechanical data

M34E02-F

30/36

DocID10367 Rev 14

Figure 14. UFDFPN8 (MLP8) – 8-lead ultra thin fine pitch dual flat package no lead

2 x 3 mm, outline

1. Drawing is not to scale.

2. The central pad (area E2 by D2 in the above illustration) is internally pulled to VSS. It must not be

connected to any other voltage or signal line on the PCB, for example during the soldering process.

Table 15. UFDFPN8 (MLP8) – 8-lead ultra thin fine pitch dual flat package no lead

2 x 3 mm, data

Symbol

millimeters

1. Values in inches are converted from mm and rounded to four decimal digits.

Typ

Min

Max

Typ

Min

Max

A

0.550

0.450

0.600

0.0217

0.0177

0.0236

A1

0.020

0.000

0.050

0.0008

0.0000

0.0020

b

0.250

0.200

0.300

0.0098

0.0079

0.0118

D

2.000

1.900

2.100

0.0787

0.0748

0.0827

D2 (rev MC)

-

1.200

1.600

-

0.0472

0.0630

E

3.000

2.900

3.100

0.1181

0.1142

0.1220

E2 (rev MC)

-

1.200

1.600

-

0.0472

0.0630

e

0.500

-

-

0.0197

-

-

K (rev MC)

-

0.300

-

-

0.0118

-

L

-

0.300

0.500

-

0.0118

0.0197

L1

-

-

0.150

-

-

0.0059

L3

-

0.300

-

-

0.0118

-

2. Applied for exposed die paddle and terminals. Exclude embedding part of exposed die paddle from

measuring.

-

0.080

-

-

0.0031

-

D

E

ZW_MEeV2

A

A1

eee

L1

e

b

D2

L

E2

L3

Pin 1

K