STOD03A datasheet(15/22 Pages) STMICROELECTRONICS

No. de pieza	STOD03A

Descripción Electrónicos	Dual DC-DC converter for powering AMOLED displays

PDF	22 Pages

Scroll/Zoom	100%

Fabricante Electrónico	STMICROELECTRONICS [STMicroelectronics]

Página de inicio	http://www.st.com

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15 / 22 page

DocID17785 Rev 3

15/22

STOD03A

Application information

7.2

Recommended PCB layout

The STOD03A is a high frequency power switching device and therefore requires a proper

PCB layout in order to obtain the necessary stability and optimize line/load regulation and

output voltage ripple.

Analog input (VINA) and power input (VINP) must be kept separated and connected together

at the CIN pad only. The input capacitor must be as close as possible to the IC.

In order to minimize ground noise, a common ground node for power ground and a different

one for analog ground must be used. In the recommended layout, the AGND node is placed

close to CREF ground while the PGND node is centered at CIN ground. They are connected

by a separated layer routing on the bottom through vias.

The exposed pad is connected to AGND through vias.

Detailed description

Figure 14. Top layer and top silkscreen top

Figure 15. Bottom layer and silkscreen top

STOD03A Datasheet(PDF) 15 Page - STMicroelectronics