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STM32F038X6 Datasheet(PDF) 83 Page - STMicroelectronics |
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STM32F038X6 Datasheet(HTML) 83 Page - STMicroelectronics |
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83 / 102 page ![]() DocID026079 Rev 5 83/102 STM32F038x6 Package information 98 Figure 33. UFQFPN32 package outline 1. Drawing is not to scale. 2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life. 3. There is an exposed die pad on the underside of the UFQFPN package. This pad is used for the device ground and must be connected. It is referred to as pin 0 in Table: Pin definitions. |
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