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FT240XS-R Datasheet(PDF) 33 Page - Future Technology Devices International Ltd.

No. de pieza FT240XS-R
Descripción Electrónicos  USB 8-BIT FIFO IC
PDF  40 Pages
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Fabricante Electrónico  FTDI [Future Technology Devices International Ltd.]
Página de inicio  http://www.ftdichip.com
Logo FTDI - Future Technology Devices International Ltd.

FT240XS-R Datasheet(HTML) 33 Page - Future Technology Devices International Ltd.

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Copyright © 2013 Future Technology Devices International Limited
33
FT240X USB 8-BIT FIFO IC Datasheet
Version 1.3
Document No.: FT_000626 Clearance No.:
FTDI# 259
9.3 QFN-24 Package Mechanical Dimensions
Figure 9.3 QFN-24 Package Dimensions
The FT240XQ is supplied in a RoHS compliant leadless QFN-24 package - WQFN(X424), with pad size
114x114. The package is lead ( Pb ) free, and uses a ‘green’ compound. The package is fully compliant
with European Union directive 2002/95/EC.
This package is nominally 4.0mm x 4.0mm. The solder pads are on a 0.50mm pitch. The above
mechanical drawing shows the QFN-24 package. All dimensions are in millimetres.
The centre pad on the base of the FT240XQ is internally connected to GND, and the PCB should not have
tracking on the top layer in this area.
The date code format is YYXX where XX = 2 digit week number, YY = 2 digit year number.
The code XXXXXXX is the manufacturing LOT code.



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