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FT221XS-R Datasheet(PDF) 38 Page - Future Technology Devices International Ltd.

No. de pieza FT221XS-R
Descripción Electrónicos  Future Technology Devices International Ltd.
PDF  45 Pages
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Fabricante Electrónico  FTDI [Future Technology Devices International Ltd.]
Página de inicio  http://www.ftdichip.com
Logo FTDI - Future Technology Devices International Ltd.

FT221XS-R Datasheet(HTML) 38 Page - Future Technology Devices International Ltd.

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Copyright © 2013 Future Technology Devices International Limited
38
FT221X USB 8-BIT SPI/FT1248 IC Datasheet
Version 1.3
Document No.: FT_000630 Clearance No.: FTDI# 263
10.3 QFN-20 Package Mechanical Dimensions
Figure 10.3 QFN-20 Package Dimensions
The FT221XQ is supplied in a RoHS compliant leadless QFN-20 package. The package is lead (Pb) free,
and uses a ‘green’ compound. The package is fully compliant with European Union directive 2002/95/EC.
This package is nominally 4.00mm x 4.00mm. The solder pads are on a 0.50mm pitch. The above
mechanical drawing shows the QFN-32 package. All dimensions are in millimetres.
The centre pad on the base of the FT221XQ is internally connected to GND, and the PCB should not have
signal tracks on the top layer under this device.



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