TM

Suffix ThickneSS

(prior To Tinning)

flaTneSS &

paralleliSM

hoT

face

cold

face

lead

length

11

0.126”± 0.005”

0.002” / 0.0035”

Lapped

Lapped

6.0

Ta

0.126”± 0.001”

0.001” / 0.001”

Lapped

Lapped

6.0”

TB

0.126”± 0.0005”

0.0005” / 0.0005” Lapped

Lapped

6.0”

Suffix SealanT color TeMp range deScripTion

r

RTV

White

-60 to 204 °C

Non-corrosive, silicone adhesive sealant

e

Epoxy

Black

-55 to 150 °C

Low density syntactic foam epoxy encapsulant

Innovative Technology

for a Connected World

Thermoelectric Modules

Americas: +1 888.246.9050

Europe: +46.31.420530

Asia: +86.755.2714.1166

clv.customerpos@lairdtech.com

www.lairdtech.com

FEaTurES

• Thermal Cycling Durability

• Power Cycling Reliability

• Precise Temperature Control

• Strong Lead Attachment

• RoHS Compliant

• Continuous Operation

at High Temperatures

appliCaTionS

• Analytical Instrumentation

• PCR Cyclers

• Thermal Test Sockets

• Electronic Enclosure Cooling

• Chillers (Liquid Cooling)

• Power Generation

cycling conditions or high temperature applications.

This product line is available in multiple configurations and is ideal for applications

that require both heating and cooling mode (reverse polarity) or power generation.

Assembled with proprietary solder construction, Bismuth Telluride semiconductor material

for higher current and larger heat-pumping applications.

perforMance SpecificaTionS

hot Side Temperature (°c)

25°C

50°C

Qmax (Watts)

24.7

27.2

delta Tmax (°c)

63

75

imax (amps)

2.9

2.9

Vmax (Volts)

14.5

16.4

Module resistance (ohms)

4.65

5.24

SEaling opTion