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HMC832LP6GETR Datasheet(PDF) 48 Page - Analog Devices |
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HMC832LP6GETR Datasheet(HTML) 48 Page - Analog Devices |
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48 / 49 page  Data Sheet HMC832 OUTLINE DIMENSIONS Figure 55. 40-Lead Quad Flat No-Lead Package [QFN] 6 mm × 6 mm Body, Very Thin Quad Dimensions shown in inches and [millimeters] Figure 56. Tape and Reel Outline Dimensions Dimensions shown in millimeters NOTES: 1. PACKAGE BODY MATERIAL: LOW STRESS INJECTION MOLDED PLASTIC SILICA AND SILICON IMPREGNATED. 2. LEAD AND GROUND PADDLE MATERIAL: COPPER ALLOY. 3. LEAD AND GROUND PADDLE PLATING: 100% MATTE TIN. 4. DIMENSIONS ARE IN INCHES [MILLIMETERS]. 5. LEAD SPACING TOLERANCE IS NON-CUMULATIVE. 6. PAD BURR LENGTH SHALL BE 0.15mm MAX. PAD BURR HEIGHT SHALL BE 0.25mm max. 7. PACKAGE WARP SHALL NOT EXCEED 0.05mm. 9. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED PCB LAND PATTERN. FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. BOT TOM VIEW TOP VIEW Rev. A | Page 47 of 48 |
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