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ADP5053ACPZ-R7 Datasheet(PDF) 9 Page - Analog Devices

No. de pieza ADP5053ACPZ-R7
Descripción Electrónicos  Integrated Power Solution with Quad Buck
PDF  37 Pages
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Fabricante Electrónico  AD [Analog Devices]
Página de inicio  http://www.analog.com
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ADP5053ACPZ-R7 Datasheet(HTML) 9 Page - Analog Devices

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ADP5053
Data Sheet
Rev. B | Page 8 of 36
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
Rating
PVIN1 to PGND
−0.3 V to +18 V
PVIN2 to PGND
−0.3 V to +18 V
PVIN3 to PGND3
−0.3 V to +18 V
PVIN4 to PGND4
−0.3 V to +18 V
SW1 to PGND
−0.3 V to +18 V
SW2 to PGND
−0.3 V to +18 V
SW3 to PGND3
−0.3 V to +18 V
SW4 to PGND4
−0.3 V to +18 V
PGND to GND
−0.3 V to +0.3 V
PGND3 to GND
−0.3 V to +0.3 V
PGND4 to GND
−0.3 V to +0.3 V
BST1 to SW1
−0.3 V to +6.5 V
BST2 to SW2
−0.3 V to +6.5 V
BST3 to SW3
−0.3 V to +6.5 V
BST4 to SW4
−0.3 V to +6.5 V
DL1 to PGND
−0.3 V to +6.5 V
DL2 to PGND
−0.3 V to +6.5 V
SS12, SS34 to GND
−0.3 V to +6.5 V
EN1, EN2, EN3, EN4 to GND
−0.3 V to +6.5 V
VREG to GND
−0.3 V to +6.5 V
SYNC/MODE to GND
−0.3 V to +6.5 V
WDI, RSTO , VTH to GND
−0.3 V to +6.5 V
MR to GND
−0.3 V to +3.6 V
RT to GND
−0.3 V to +3.6 V
PWRGD to GND
−0.3 V to +6.5 V
FB1, FB2, FB3, FB4 to GND1
−0.3 V to +3.6 V
FB2 to GND2
−0.3 V to +6.5 V
FB4 to GND2
−0.3 V to +7 V
COMP1, COMP2, COMP3, COMP4 to GND
−0.3 V to +3.6 V
VDD to GND
−0.3 V to +3.6 V
Storage Temperate Range
−65°C to +150°C
Operational Junction Temperature Range
−40°C to +125°C
1 This rating applies to the adjustable output voltage models of the ADP5053.
2 This rating applies to the fixed output voltage models of the ADP5053.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 6. Thermal Resistance
Package Type
θJA
θJC
Unit
48-Lead LFCSP
27.87
2.99
°C/W
ESD CAUTION



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